Electronic circuit bonding interconnect component and flip chip

Details Electronic circuit bonding interconnect component and flip chip Electronic circuit bonding interconnect component and flip chip

1998-07-08

2000-09-05

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438108, 438611, 438613, H01L 2144

Patent

active

061142395

ABSTRACT:
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.

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Tummala, Rao R. & Rymaszewski, Eugene J., "Microelectronics Packaging Handbook", Jan. 1, 1989 pp. 366-391; Van Nostrand Reinhold.

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