Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-08-09
2011-08-09
Chervinsky, Boris (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S760000, C257S738000, C257S737000, C257S780000
Reexamination Certificate
active
07994428
ABSTRACT:
An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.
REFERENCES:
patent: 6139348 (2000-10-01), Fukunaga
patent: 6562545 (2003-05-01), Hembree et al.
patent: 7064435 (2006-06-01), Chung et al.
patent: 7265430 (2007-09-01), Naito et al.
patent: 2010/0073531 (2010-03-01), Yano et al.
Lin Chang Chang-fu
Tsai Kuo-Ching
Chervinsky Boris
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Siliconware Precision Industries Co., LTD.
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