Electronic carrier board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C361S760000, C257S738000, C257S737000, C257S780000

Reexamination Certificate

active

07994428

ABSTRACT:
An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.

REFERENCES:
patent: 6139348 (2000-10-01), Fukunaga
patent: 6562545 (2003-05-01), Hembree et al.
patent: 7064435 (2006-06-01), Chung et al.
patent: 7265430 (2007-09-01), Naito et al.
patent: 2010/0073531 (2010-03-01), Yano et al.

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