Electronic assembly package including connecting member between

Details Electronic assembly package including connecting member between Electronic assembly package including connecting member between

1995-08-30

1999-04-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361803, 174263, 174266, H05K 111

Patent

active

058962760

ABSTRACT:
An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

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Article from the Society for Hybrid Microelectronics--(Concise statement of relevance attached to article).
French Search Report, dated Jan. 12, 1998.

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