Electronic assembly having multi-material interconnects

Details Electronic assembly having multi-material interconnects Electronic assembly having multi-material interconnects

2007-02-27

2007-02-27

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S256000

Reexamination Certificate

active

10883433

ABSTRACT:
According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

REFERENCES:
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patent: 2001/0055866 (2001-12-01), Smith et al.
patent: 2004/0038560 (2004-02-01), Mathieu et al.
Lang's Handbook of Chemistry (15th Edition) Date 1999.

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