Electronic assembly and circuit board

Details Electronic assembly and circuit board Electronic assembly and circuit board

2008-07-29

2008-07-29

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S666000

Reexamination Certificate

active

07405483

ABSTRACT:
A circuit board assembled with an electronic package having a first and a second inner leads is provided. The first inner lead has a first and a second ends. The circuit board includes an insulating layer, a first pad, a second pad, an extension portion, a conductive via, and a ground layer. The first and the second pads are disposed on the insulating layer. The first end of the first inner lead is electrically connected to the second pad. The extension portion disposed on the insulating layer is electrically connected to the first pad and extends to the position under the second end of the first inner lead. The conductive via passing through the insulating layer is electrically connected to the extension portion and under the second end of the first inner lead. The ground layer disposed on the insulating layer is electrically connected to the conductive via.

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