Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-12-05
2006-12-05
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S707000, C257S720000, C361S720000
Reexamination Certificate
active
07145231
ABSTRACT:
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
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Harper,Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, 1.48,6.71-6.73.
Harada Masahide
Hasebe Takehiko
Hozoji Hiroshi
Matsuzaki Eiji
Ushifusa Nobuyuki
Andujar Leonardo
Antonelli, Terry Stout and Kraus, LLP.
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