Electronic apparatus

Details Electronic apparatus Electronic apparatus

2006-12-05

2006-12-05

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S707000, C257S720000, C361S720000

Reexamination Certificate

active

07145231

ABSTRACT:
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

REFERENCES:
patent: 4628407 (1986-12-01), August et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6310391 (2001-10-01), Nagasawa et al.
patent: 6528882 (2003-03-01), Ding et al.
patent: 0 981 268 (2000-02-01), None
patent: 06-169189 (1994-06-01), None
patent: A-6-169189 (1994-06-01), None
patent: A-7-326690 (1995-12-01), None
patent: 2000012723 (2000-01-01), None
Harper,Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, 1.48,6.71-6.73.

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