Electronic and optoelectronic component packaging technique

Details Electronic and optoelectronic component packaging technique Electronic and optoelectronic component packaging technique

2005-10-04

2005-10-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S704000, C257S723000, C361S535000

Reexamination Certificate

active

06952046

ABSTRACT:
A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.

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