Etching a substrate: processes – Etching and coating occur in the same processing chamber
Reexamination Certificate
2006-08-14
2010-11-16
Alanko, Anita K (Department: 1713)
Etching a substrate: processes
Etching and coating occur in the same processing chamber
C216S059000, C216S063000, C216S067000, C216S079000, C438S694000, C438S695000, C438S706000, C438S758000, C427S596000, C427S096100
Reexamination Certificate
active
07833427
ABSTRACT:
Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching function and concurrently form a protective coating on other regions. An electron beam provides activation to selective chemical species. In one example, reactive species are generated from a halogen and carbon containing gas source. Addition of other gasses to the system can provide functions such as controlling a chemistry in a protective layer during a processing operation.
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Rueger Neal R.
Sandhu Gurtej S.
Williamson Mark J.
Alanko Anita K
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
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