Electromigration-resistant and compliant wire interconnects,...

Details Electromigration-resistant and compliant wire interconnects,... Electromigration-resistant and compliant wire interconnects,...

2005-06-30

2009-11-10

Pham, Hoai V (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257SE21508

Reexamination Certificate

active

07615476

ABSTRACT:
A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.

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