Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Patent
1995-12-14
1998-11-03
Hardy, David B.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including dielectric isolation means
257659, H01L 2906
Patent
active
058313249
ABSTRACT:
A method for suppressing an electromagnetic wave in a semiconductor manufacturing process contemplates diffusion of a material into a region where active elements for processing a high speed digital signal are massed. During a wafer manufacturing process, high temperature particles of the material is diffused to shield the active elements of the integrated circuit from electromagnetic waves, and the integrated circuit is packaged in a circuit interlocking a wafer chip and external electrical conducting pins emanating from the integrated circuit are wrapped with a material exhibiting a resistance varying directly with the frequency of a high frequency components of electromagnetic interference. Since a main portion is surrounded by a material for shielding an electromagnetic wave in a wafer manufacturing process and a package manufacturing process for the manufactured wafer chip, electromagnetic shielding is obtained relative to other circuits on the chip. As a result, a high frequency component can be prevented from being externally radiated.
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Bushnell Esq. Robert E.
Hardy David B.
Samsung Electronics Co,. Ltd.
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