Electrolytic processing apparatus and substrate processing...

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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Reexamination Certificate

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07374646

ABSTRACT:
The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate has a large area, and controlling more uniformly a speed, over the entire surface to be processed of the substrate. The electrolytic processing apparatus of this invention includes: a substrate holder for holding a substrate, a first electrode for being brought into contact with the substrate to supply current to a surface, to be processed, of the substrate; a second electrode disposed substantially parallel to the surface, to be processed, of the substrate in a position facing the surface, to be processed, of the substrate held by the substrate holder; a high resistance structure disposed between the substrate held by the substrate holder and the second electrode; an electrolytic solution introducing portion for introducing an electrolytic solution into a region across which the substrate held by the substrate holder and the high resistance structure face each other, from laterally of the high resistance structure; and a power source for applying a voltage between the first electrode and the second electrode.

REFERENCES:
patent: 5597460 (1997-01-01), Reynolds
patent: 6368475 (2002-04-01), Hanson et al.
patent: 6632335 (2003-10-01), Kunisawa et al.
patent: 6949172 (2005-09-01), Hosten et al.
patent: 2001/0052465 (2001-12-01), Dordi et al.
patent: 2002/0020627 (2002-02-01), Kunisawa et al.
patent: WO 01/12882 (2001-02-01), None

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