Electrolyte with good planarization capability, high removal...

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Electrolyte composition or defined electrolyte

Reexamination Certificate

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C205S682000, C252S079100

Reexamination Certificate

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06863797

ABSTRACT:
Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.

REFERENCES:
patent: 2582020 (1952-01-01), Emery
patent: 3239441 (1966-03-01), Marosi
patent: 3873512 (1975-03-01), Latanision
patent: 4263113 (1981-04-01), Bernard
patent: 4663005 (1987-05-01), Edson
patent: 4666683 (1987-05-01), Brown et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 4992135 (1991-02-01), Doan
patent: 5002645 (1991-03-01), Eastland, Jr. et al.
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5114548 (1992-05-01), Rhoades
patent: 5129981 (1992-07-01), Wang et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5391258 (1995-02-01), Branacaleoni et al.
patent: 5407526 (1995-04-01), Danielson et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 5783489 (1998-07-01), Kaufman et al.
patent: 5800577 (1998-09-01), Kido
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5846882 (1998-12-01), Birang
patent: 5866031 (1999-02-01), Carpio et al.
patent: 5880003 (1999-03-01), Hayashi
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5965036 (1999-10-01), Maki et al.
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6056864 (2000-05-01), Cheung
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6068879 (2000-05-01), Pasch
patent: 6077412 (2000-06-01), Ting et al.
patent: 6083840 (2000-07-01), Mravic et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6096652 (2000-08-01), Watts et al.
patent: 6099604 (2000-08-01), Sandhu et al.
patent: 6103096 (2000-08-01), Datta et al.
patent: 6106728 (2000-08-01), Iida et al.
patent: 6117775 (2000-09-01), Kondo et al.
patent: 6117783 (2000-09-01), Small et al.
patent: 6117853 (2000-09-01), Sakai et al.
patent: 6121152 (2000-09-01), Adams et al.
patent: 6126853 (2000-10-01), Kaufman et al.
patent: 6139763 (2000-10-01), Ina et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6143656 (2000-11-01), Yang et al.
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6171352 (2001-01-01), Lee et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6177026 (2001-01-01), Wang et al.
patent: 6190237 (2001-02-01), Huynh et al.
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6217416 (2001-04-01), Kaufman et al.
patent: 6218305 (2001-04-01), Hosali et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238592 (2001-05-01), Hardy et al.
patent: 6248222 (2001-06-01), Wang
patent: 6258711 (2001-07-01), Laursen
patent: 6258721 (2001-07-01), Li et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6280598 (2001-08-01), Barton et al.
patent: 6299741 (2001-10-01), Sun et al.
patent: 6303049 (2001-10-01), Lee et al.
patent: 6303551 (2001-10-01), Li et al.
patent: 6310019 (2001-10-01), Kakizawa et al.
patent: 6315803 (2001-11-01), Ina et al.
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6348076 (2002-02-01), Canaperi et al.
patent: 6354916 (2002-03-01), Uzoh et al.
patent: 6355075 (2002-03-01), Ina et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6375693 (2002-04-01), Cote et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6416685 (2002-07-01), Zhang et al.
patent: 6419554 (2002-07-01), Chopra et al.
patent: 6428721 (2002-08-01), Ina et al.
patent: 6429133 (2002-08-01), Chopra
patent: 6440186 (2002-08-01), Sakai et al.
patent: 6440295 (2002-08-01), Wang
patent: 6447371 (2002-09-01), Kaufman et al.
patent: 6454819 (2002-09-01), Yano et al.
patent: 6455479 (2002-09-01), Sahbari
patent: 6508952 (2003-01-01), Lee et al.
patent: 6551935 (2003-04-01), Sinha et al.
patent: 6555158 (2003-04-01), Yoshio et al.
patent: 6562719 (2003-05-01), Kondo et al.
patent: 6565619 (2003-05-01), Asano et al.
patent: 6569349 (2003-05-01), Wang et al.
patent: 6579153 (2003-06-01), Uchikura et al.
patent: 6593239 (2003-07-01), Kaufman et al.
patent: 6596638 (2003-07-01), Kondo et al.
patent: 6602112 (2003-08-01), Tran et al.
patent: 6605537 (2003-08-01), Bian et al.
patent: 6616976 (2003-09-01), Montano et al.
patent: 6620215 (2003-09-01), Li et al.
patent: 6676484 (2004-01-01), Chopra
patent: 6679928 (2004-01-01), Costas et al.
patent: 6679929 (2004-01-01), Asano et al.
patent: 6693036 (2004-02-01), Nogami et al.
patent: 20010016469 (2001-08-01), Chopra
patent: 20010024878 (2001-09-01), Nakamura
patent: 20010036746 (2001-11-01), Sato et al.
patent: 20010042690 (2001-11-01), Talieh
patent: 20020008036 (2002-01-01), Wang
patent: 20020016064 (2002-02-01), Komai et al.
patent: 20020016073 (2002-02-01), Kondo et al.
patent: 20020016272 (2002-02-01), Kakizawa et al.
patent: 20020040100 (2002-04-01), Kume et al.
patent: 20020070126 (2002-06-01), Sato et al.
patent: 20020072309 (2002-06-01), Sato et al.
patent: 20020074230 (2002-06-01), Basol
patent: 20020088709 (2002-07-01), Hongo et al.
patent: 20020096659 (2002-07-01), Sakai et al.
patent: 20020108861 (2002-08-01), Emesh et al.
patent: 20020139055 (2002-10-01), Asano et al.
patent: 20020160698 (2002-10-01), Sato et al.
patent: 20030073386 (2003-04-01), Ma et al.
patent: 20030079416 (2003-05-01), Ma et al.
patent: 20030083214 (2003-05-01), Kakizawa et al.
patent: 20030104762 (2003-06-01), Sato et al.
patent: 20030113996 (2003-06-01), Nogami et al.
patent: 20030114004 (2003-06-01), Sato et al.
patent: 20030116445 (2003-06-01), Sun et al.
patent: 20030136055 (2003-07-01), Li et al.
patent: 20030153184 (2003-08-01), Wang et al.
patent: 20030170091 (2003-09-01), Shomler et al.
patent: 0 527 537 (1993-02-01), None
patent: 0 699 782 (1996-03-01), None
patent: 0 811 665 (1997-12-01), None
patent: 0 846 742 (1998-06-01), None
patent: 1 103 346 (2001-05-01), None
patent: 1 167 585 (2002-01-01), None
patent: 1 170 761 (2002-09-01), None
patent: 2001-77117 (2001-03-01), None
patent: 1 618 538 (1991-01-01), None
patent: 9804646 (1998-02-01), None
patent: WO 9849723 (1998-11-01), None
patent: WO 9946353 (1999-09-01), None
patent: 9953532 (1999-10-01), None
patent: 9965072 (1999-12-01), None
patent: 0026443 (2000-05-01), None
patent: 00 55876 (2000-09-01), None
patent: 0177241 (2001-10-01), None
patent: WO 0177241 (2001-10-01), None
patent: WO 02 23616 (2002-03-01), None
patent: 02 075804 (2002-09-01), None
patent: WO 02 088229 (2002-11-01), None
patent: WO 03 060962 (2003-07-01), None
U.S. Appl. No. 09/163,582, filed Sep. 30, 1998, Entitled “Improved Copper Cleaning Solution and Method For Using Same”, 26 pages.
U.S. Appl. No. 09/450,937, filed Nov. 29, 1999, Entitled “Method and Apparatus for Electrochemical-Mechanical Planarization”, 30 pages.
International Search Report, dated Aug. 5, 2003 for PCT/US02/40754.
U.S. Appl. No. 09/905,315, filed Jul. 13, 2001, Entitled “Electrochemically Assisted Chemical Polish”, 24 pages.
U.S. Appl. No. 09/608,078, filed Jun. 30, 2000, Entitled “A Novel Solution to Metal Re-Deposition During Substrate Planarization”, 18 pages.
U.S. Appl. No. 10/038,066, filed Jan. 3, 2002, Entitled “Pla

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