Electroluminescent device having sub-interlayers for high lumino

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular semiconductor material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 78, 313509, H01L 3300

Patent

active

052296288

ABSTRACT:
An electroluminescence device is constituted by sequentially stacking a glass substrate, a transparent electrode, a luminescent layer, an interlayer containing a semiconductor having a band gap of 2.4 eV or more, a current-limiting layer containing a conductive powder, and a backplate.

REFERENCES:
patent: 3919589 (1975-11-01), Hanak
patent: 3975661 (1976-08-01), Kanatani et al.
patent: 4266223 (1981-05-01), Frame
patent: 4416933 (1983-11-01), Antson et al.
patent: 4418118 (1983-11-01), Lindors
patent: 4668582 (1987-05-01), Matsuoka et al.
patent: 4672264 (1987-06-01), Higton
patent: 4751427 (1988-06-01), Barrow et al.
patent: 4758765 (1988-07-01), Mitsumori
patent: 4849673 (1989-07-01), Werring et al.
patent: 4967251 (1990-10-01), Tanaka et al.
patent: 5074817 (1991-12-01), Song
Lee et al., "Possible Degradation Mechanism in ZnS:Mn Alternating Current Thin Film Electroluminescent Display", Appl. Phys. Lett., vol. 58, No. 9, Mar. 4, 1991.
SID 84 Digest entitled "High-Contract Thin-Film/Powder Composite DCEL Devices" by Malcolm H. Higton, 1984.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electroluminescent device having sub-interlayers for high lumino does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroluminescent device having sub-interlayers for high lumino, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroluminescent device having sub-interlayers for high lumino will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1762724

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.