Electroless plating system

Details Electroless plating system Electroless plating system

2011-07-05

2011-07-05

Richards, N Drew (Department: 2895)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

Reexamination Certificate

active

07972652

ABSTRACT:
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.

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Shacham-Diamond, Y “High Aspect Ratio Quarter-Micron Electroless Copper Technology” Mat. for Adv. Met. 1997, MAM '97 Abstracts Booklet European Workshop pp. 11-14.
Matsuda, H “The effect of dissolved oxygen on the deposition process in electroless cobalt plating” Journal of Applied Electrochemistry vol. 23 (1993) pp. 183-186.

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