Electroless plating of portions of semiconductor devices and the

Details Electroless plating of portions of semiconductor devices and the Electroless plating of portions of semiconductor devices and the

1989-10-16

1991-07-02

Beck, Shrive P.

Coating processes

Electrical product produced

Metal coating

427125, C23C 2600

Patent

active

050284541

ABSTRACT:
A method for electrolessly plating portions of semiconductor devices and the like comprises the steps of providing a first metal having a higher electromotive series than a coating metal, galvanically coupling a second metal to the first metal wherein a portion of the first metal remains exposed and then subjecting the second metal and the exposed portion of the first metal to an electroless coating metal plating solution. The method employs no masks and is ideal for plating small areas such as single ball bonds and limited numbers of ball bonds on a single semiconductor chip.

REFERENCES:
patent: 3453501 (1969-07-01), Dunkle
patent: 3537878 (1970-11-01), Bandrand
patent: 3672939 (1972-06-01), Miller
patent: 3729807 (1973-05-01), Fujiwara
patent: 3956528 (1976-05-01), Ugro
patent: 4339476 (1982-07-01), Feldstein
patent: 4349585 (1982-09-01), Nagashima
patent: 4567066 (1986-01-01), Schultz
"The Electromotive Series for Metals and Alloys" Metal Finishing, vol. 50, No. 4, Apr., 1952, p. 89.

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