Electroless plating method and apparatus

Details Electroless plating method and apparatus Electroless plating method and apparatus

2006-10-05

2010-11-09

Bareford, Katherine A (Department: 1715)

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

C427S314000, C438S678000

Reexamination Certificate

active

07829152

ABSTRACT:
An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.

REFERENCES:
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patent: 5830805 (1998-11-01), Shacham-Diamand et al.
patent: 5960159 (1999-09-01), Ikeda et al.
patent: 2003/0029570 (2003-02-01), Kawamura et al.
patent: 2004/0052963 (2004-03-01), Ivanov et al.
patent: 2005/0022745 (2005-02-01), Nakano et al.
patent: 2005/0084615 (2005-04-01), Weidman et al.

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