Electroless plating apparatus with non-liquid heating source

Details Electroless plating apparatus with non-liquid heating source Electroless plating apparatus with non-liquid heating source

2011-06-28

2011-06-28

Tadesse, Yewebdar T (Department: 1713)

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Radiant heating

C118S052000, C118S319000, C118S320000, C118S641000

Reexamination Certificate

active

07966968

ABSTRACT:
An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.

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