Electroless plating apparatus, semiconductor wafer having...

Details Electroless plating apparatus, semiconductor wafer having... Electroless plating apparatus, semiconductor wafer having...

2006-06-27

2006-06-27

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S613000, C205S117000, C205S118000

Reexamination Certificate

active

07067423

ABSTRACT:
An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side, the treatment side being a side facing the electroless plating solution; and a solution supplier which causes the electroless plating solution to flow so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.

REFERENCES:
patent: 5290732 (1994-03-01), Kumar et al.
patent: 6709901 (2004-03-01), Yamazaki et al.

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