Electroless deposition of nickel on aluminum

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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106 122, 106 127, 156656, 156665, 252 793, 252 794, 427304, 427328, 427307, 427430A, 427437, 427438, C23C 302

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active

041256484

ABSTRACT:
A method for depositing electroless nickel on aluminum or aluminum alloy is described. The method is particularly useful for fabricating bonding pads on aluminum metallized semiconductor devices and for creating beam leads. The described method deposits a thick nickel layer directly on aluminum without the use of intermediate layers or surface activation as required in the prior art. The method basically comprises immersion in a stop-etchant which simultaneously removes aluminum oxide and activates the surface; immersion in a solution which activates the aluminum with nickel ions and deactivates mask material; and immersion in a novel electroless nickel bath. A technique for electrolessly depositing gold is also described.

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Gold Plating Technology, Electrochemical Publications Limited, "Electroless Solutions," Y. Okinaka, pp. 86, 87, (1974).

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