Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-12-27
1978-10-24
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
106 122, 106 123, 106 127, 156656, 156665, 427 94, 427 98, 427282, 427287, 427304, 427305, 427327, 427328, 427430A, 427437, 427438, C23C 302
Patent
active
041222156
ABSTRACT:
A method for depositing electroless nickel on aluminum or aluminum alloy is described. The method is particularly useful for fabricating bonding pads on aluminum metallized semiconductor devices and for creating beam leads. The described method deposits a thick nickel layer directly on aluminum without the use of intermediate layers or surface activation as required in the prior art. The method basically comprises immersion in a stop-etchant which simultaneously removes aluminum oxide and activates the surface; immersion in a solution which activates the aluminum with nickel ions and deactivates mask material; and immersion in a novel electroless nickel bath. A technique for electrolessly depositing gold is also described.
REFERENCES:
patent: 2976181 (1961-03-01), Brookshire
patent: 3329522 (1967-07-01), Saubestre et al.
patent: 3489603 (1970-01-01), Daster et al.
patent: 3551122 (1970-12-01), Gulla
patent: 3579375 (1971-05-01), Wonilowicz
patent: 3666529 (1972-05-01), Wright et al.
patent: 3669734 (1972-06-01), Jacob et al.
patent: 3672964 (1972-06-01), Bellis
patent: 3726771 (1973-04-01), Coll-Palagos
Gold Plating Technology, Electrochemical Publications Limited, "Electroless Solutions," Y. Okinata, pp. 86, 87 (1974).
Bell Telephone Laboratories Incorporated
Smith John D.
Urbano Michael J.
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