Coating processes – With pretreatment of the base – Metal base
Patent
1978-04-14
1979-05-15
Smith, John D.
Coating processes
With pretreatment of the base
Metal base
106 126, 156664, 252 793, 252 794, 427304, 427307, 427430A, 427437, C23C 302
Patent
active
041548779
ABSTRACT:
A method for depositing electroless nickel on aluminum or aluminum alloy is described. The method is particularly useful for fabricating bonding pads on aluminum metallized semiconductor devices and for creating beam leads. The described method deposits a thick nickel layer directly on aluminum without the use of intermediate layers or surface activation as required in the prior art. The method basically comprises immersion in a stop-etchant which simultaneously removes aluminum oxide and activates the surface; immersion in a solution which activates the aluminum with nickel ions and deactivates mask material; and immersion in a novel electroless nickel bath. A technique for electrolessly depositing gold is also described.
REFERENCES:
patent: 2976181 (1961-03-01), Brookshire
patent: 3123484 (1964-03-01), Pokrus et al.
patent: 3468676 (1969-09-01), Schneble et al.
patent: 3642549 (1972-02-01), Couture et al.
patent: 4040897 (1977-08-01), Blish et al.
patent: 4082908 (1978-04-01), Vanaglash
Reid et al., Gold Plating Technology, Electrochemical Publications Limited, 1974.
Bell Telephone Laboratories Incorporated
Smith John D.
Urbano Michael J.
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