Electroless copper plating solution and process for electrolessl

Details Electroless copper plating solution and process for electrolessl Electroless copper plating solution and process for electrolessl

1987-11-05

1989-05-30

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427305, B05B 512, C23C 1600

Patent

active

048347965

ABSTRACT:
A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.

REFERENCES:
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4448804 (1984-05-01), Amelio et al.
patent: 4650691 (1987-03-01), Kinoshita et al.
patent: 4684545 (1987-08-01), Fey et al.
Francis J. Nuzzi, "Accelerating the Rate of Electroless Copper Plating" (Plating and Surface Finishing, Jan. 1983).

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