Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1976-07-12

1977-11-22

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427437, C23C 302

Patent

active

040594513

ABSTRACT:
An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.

REFERENCES:
patent: 3137713 (1964-06-01), Shen et al.
patent: 3615732 (1971-10-01), Shipley et al.
patent: 3959523 (1976-05-01), Grunwald et al.
patent: 3959531 (1976-05-01), Schneble et al.
patent: 3959547 (1976-05-01), Polichette et al.

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