Electroless copper plating and bath therefor

Details Electroless copper plating and bath therefor Electroless copper plating and bath therefor

1986-04-25

1987-08-04

Smith, John D.

Coating processes

Immersion or partial immersion

Metal base

106 123, 106 126, 427 98, 4274431, C23C 1840

Patent

active

046845500

ABSTRACT:
Electroless copper is plated from aqueous plating baths comprising a soluble copper salt, ethylenediamine tetraacetic acid, dimethylamine borane, thiodyglycolic acid and a surfactant reaction product of ethylene oxide and an acetylenic glycol.

REFERENCES:
patent: Re29285 (1977-06-01), Christin
patent: 3870526 (1975-03-01), Pearlstein
patent: 4143186 (1979-03-01), Davis
patent: 4371397 (1983-02-01), Honma
Pearlstein, "Electroless Copper Plating Using Dimethylamine Borane", Plating, May 1973, pp. 474-476.

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