Electroformed sputtering target

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...

Reexamination Certificate

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Details

C205S114000, C205S118000, C205S170000, C205S261000, C204S484000

Reexamination Certificate

active

10431399

ABSTRACT:
A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surface of the preform to form the target. The method can be applied to form a sputtering target having a non-planar surface.

REFERENCES:
patent: 3716462 (1973-02-01), Jensen
patent: 3725220 (1973-04-01), Kessler et al.
patent: 4415421 (1983-11-01), Sasanuma
patent: 4430173 (1984-02-01), Boudot et al.
patent: 5435965 (1995-07-01), Mashima et al.
patent: 5487822 (1996-01-01), Demaray et al.
patent: 5803342 (1998-09-01), Kardokus
patent: 6071389 (2000-06-01), Zhang
patent: 6179973 (2001-01-01), Lai et al.
patent: 6251242 (2001-06-01), Fu et al.
patent: 6274008 (2001-08-01), Gopalraja et al.
patent: 6277249 (2001-08-01), Gopalraja et al.
patent: 6277263 (2001-08-01), Chen
patent: 6283357 (2001-09-01), Kulkarni et al.
patent: 6406599 (2002-06-01), Subramani et al.
patent: 6413382 (2002-07-01), Wang et al.
patent: 6419806 (2002-07-01), Holcomb et al.
patent: 6436251 (2002-08-01), Gopalraja et al.
patent: 6482302 (2002-11-01), Li et al.
patent: 6619537 (2003-09-01), Zhang et al.
patent: 6709557 (2004-03-01), Kailasam et al.
patent: 6716321 (2004-04-01), Gilmore et al.
patent: 6848608 (2005-02-01), Wickersham, Jr.
patent: 6887356 (2005-05-01), Ford et al.
patent: 2001/0035237 (2001-11-01), Nagano et al.
patent: 2001/0035238 (2001-11-01), Nagano et al.
patent: 2002/0014289 (2002-02-01), Nagano et al.
patent: 2 049 737 (1980-12-01), None
patent: 58-147558 (1983-09-01), None
patent: 58-147558 (1983-09-01), None
patent: 11-106904 (1999-04-01), None
patent: WO 01 39250 (2001-05-01), None

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