Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1994-09-27
1997-10-07
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430330, 156150, 156151, 427365, 427366, G03F 716, B05D 312
Patent
active
056746598
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method for producing a photoresist film for use in producing a precision fine process component in which a photoresist film is formed by the electrodeposition coating method and thereafter the film is subjected to exposure, development, etching, and the like.
BACKGROUND ART
Conventionally, a photo-etching method has been used to produce a precision fine process component utilizing a photoresist. The detail of the method is disclosed in "Illustrated Explanation of Photo-fabrication" written by Takao Hashimoto (Issued by Sougou Denshi Shuppan on Jul. 10, 1986).
In forming, for example, a wiring pattern on a printed wiring board, the pattern is formed by forming a photoresist film on a metal material such as a copper-clad laminate, exposing the laminate with a pattern mask superimposed on the laminate, dissolving the unexposed portion with a developing solution, and further etching the exposed portion of metal with a metal etching solution. As the aforementioned resist film forming method, there can be enumerated (i) a method of laminating a film having a photoresist layer, (ii) a method of coating a liquid-like photoresist by dip coating, roll coating, curtain coating, or the like, and (iii) a method of forming a photoresist layer by electrodeposition coating.
The above-mentioned (iii) method of electrodeposition coating has drawn attention for the reasons of (a) good adhesion to the base material, (b) good followability to the surface unevenness, and (c) capability of processing hole inner surfaces of a board provided with through holes, and the like, and therefore the method has been increasingly put into practice in recent years.
In the electrodeposition coating process of a printed wiring board, there has been conventionally used the method of immersing printed wiring boards in an electrodepositing solution while suspending the boards in the solution in a manner as shown in FIG. 3, flowing an electric current, pulling up the board, cleansing the board with water, and removing the remaining moisture component in the formed film of the printed wiring boards 20, . . . , 20 in a heating dryer 21 while simultaneously heat-fusing the film to complete film formation. According to the recent trend of the increase in wiring density and fineness of printed wiring boards, there has been a growing demand for coping with finer circuits and thinner boards.
However, according to the conventional resist film drying method, there have been (1) the problem that a time of 5 to 10 minutes is required for the sufficient drying by heating and a dark reaction in the unexposed portion progresses during this time to result in a limited resolution after development to consequently fail in forming a fine circuit pattern, and (2) the problem that a thin board has insufficient rigidity to cause the boards in the drying heater to be put in contact with each other to result in damaging the resist.
The inventors of the present invention have conducted intensive research and study to resolve the aforementioned problems, and discovered the fact that satisfactory removal of moisture component and film formation by heating for a shorter time period can be achieved by roll-pressing the resist film after the electrodeposition coating process by means of pressure rolls with heat applied to allow formation of a resist film having a resolution much finer than that of the conventional method and further allow easy drying of a thin board.
Accordingly, the object of the present invention is to solve the aforementioned problems and provide a method for producing a photoresist film for use in producing a precision fine process component capable of achieving removal of moisture component and film formation by heating in a short time, forming a resist film having a resolution much finer than that of the conventional method, and easily drying a thin board.
DISCLOSURE OF INVENTION
In order to achieve the aforementioned objective, the present invention is constructed so that the resist film obtain
REFERENCES:
patent: 5037504 (1991-08-01), Takeuchi et al.
Takao Hashimoto, "Illustrated Explanation of Photofabrication", Issued by Sougou Denshi Shuppan, Jul. 10, 1986.
Patent Abstracts of Japan, vol. 16, No. 444 (E-1265) Sep. 16, 1992 & JP-A-04 155 884 (Hitachi) May 28, 1992.
Database WPI, Week 7547, Derwent Publications Ltd., London, GB; AN 75-77631W&JP-A-50 041 937 (Toa Synthetic Chem) Apr. 16, 1975.
Matsuo Seiichi
Nagata Kouichi
Shimizu Makoto
Tanaka Shigeharu
Chu John S.
Nippon Paint Co. Ltd.
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