Electrodeposition coating composition for use in printed circuit

Details Electrodeposition coating composition for use in printed circuit Electrodeposition coating composition for use in printed circuit

1988-11-01

1991-12-03

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430308, 522 86, 522 90, 522149, 524555, G03F 712, G03F 7028

Patent

active

050700006

ABSTRACT:
Disclosed is an electrodeposition coating composition for use in printed circuit board photo resist, comprising (a) an acrylic resin containing (meth)acryloyl group and obtained by use of diacetone (meth)acrylamide as an essential monomer component, said acrylic resin being a water-soluble or water-dispersible photo-curable unsaturated resin having an acid value of 20 to 300, a degree of unsaturation of 0.2 to 4.5 moles/kg, a number average molecular weight of 1,000 to 100,000 and a glass transition temperature of 0.degree. to 100.degree. C., and (b) a water-insoluble photopolymerization initiator.

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