Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-05-03
2005-05-03
Gilliam, Barbara L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S318000, C430S324000, C430S325000
Reexamination Certificate
active
06887651
ABSTRACT:
A hybrid photolithography process for printed circuit board patterning combines two types of photoresist applications to achieve superior protection of printed circuit board (PCB) ‘plated through holes’ (PTH). In a first step, electro-deposited (ED) photoresist (also known as “ED resist”) is applied to a fully copper plated PCB including the ‘plated through holes’ to protect the outer layers and the ‘plated through holes’ from copper etchant solution. In a second step, the electro-deposited photoresist is imaged (exposed) and patterned (developed). In a third step, after developing the circuit image, a layer of Dry Film resist is applied to the panel of the PCB on top of the developed electro-deposited (ED) photoresist. This Dry Film resist layer will ‘tent’ the plated through holes by adding an extra layer of protection to the plated through holes. In a fourth step, the dry film resist is then exposed and developed. At this point, the PCB is etched as normal and all subsequent processing remains unchanged.
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Bhatt Ashwinkumar C.
Blomberg Brant S.
Keesler Ross W.
Longo Michael V.
Smith Eboney J. N.
Bouchard John H.
Gilliam Barbara L.
International Business Machines - Corporation
Steinberg William H.
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