Electrode/probe assemblies and plasma processing chambers...

Details Electrode/probe assemblies and plasma processing chambers... Electrode/probe assemblies and plasma processing chambers...

2007-11-21

2011-10-25

Kackar, Ram N. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C156S345240, C156S345470, C118S715000, C118S7230AN

Reexamination Certificate

active

08043470

ABSTRACT:
The present invention relates generally to plasma processing chambers and electrode assemblies used therein. According to one embodiment, an electrode assembly comprises a thermal control plate, a silicon-based showerhead electrode, and a probe assembly comprising an electrically conductive probe body and a silicon-based cap. The electrode assembly is configured such that the handedness of a threaded engagement of the silicon-based cap and a head section of the probe body and the handedness of the threaded engagement of the thermal control plate and a mid-section of the probe body have a common direction of rotation. Thereby, an application of torque to the silicon-based cap in a tightening direction of rotation tightens both threaded engagements. Further, the electrode assembly is configured such that the threaded engagement of the silicon-based cap and a head section of the probe body permits repetitive non-destructive engagement and disengagement of the silicon-based cap and the probe body.

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