Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-03-18
1994-10-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156345, 20429832, G01C 500, H01L 2100
Patent
active
053544137
ABSTRACT:
A high precision electrode position controller is provided for use in a semiconductor etching device. The electrode position controller, system, and method of use can accurately and repeatedly position a dry etch electrode within the etch chamber without having to open the chamber and manually move the electrode. Moreover, the actual gap between electrodes can be calibrated each time the etching device is turned on. Frequent calibration of actual electrode position ensures the electrodes are positioned parallel to each other and at an optimal distance therebetween. Accurate positioning of the electrodes provides a more precise etch rate and a more uniform etch across the wafer surface. By repositioning the electrodes and maintaining parallelism, varying types of material can be accurately etched.
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Conboy Michael R.
Sikes Roger A.
Smesny Greg A.
Advanced Micro Devices , Inc.
Daffer Kevin L.
Dang Thi
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