Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2005-05-02
2009-06-16
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C438S614000, C257S786000
Reexamination Certificate
active
07547976
ABSTRACT:
A pad structure100includes an electrode pad (a first electrically conducting film104and a second electrically conducting film110) and an insulating film provided over a peripheral region of the electrode pad so as to surround the electrode pad, and the insulating film has a structure including a protective film (a cover oxide film106) and a transparent resin film (a transparent resin108) provided on the cover oxide film106.
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Furumiya Masayuki
Moriya Taro
Nakashiba Yasutaka
Uchiya Satoshi
Arora Ajay K
Le Thao X
NEC Electronics Corporation
Young & Thompson
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