Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor
Reexamination Certificate
2007-07-31
2007-07-31
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
C205S118000, C205S220000, C205S221000, C205S222000, C205S223000
Reexamination Certificate
active
10434493
ABSTRACT:
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
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Cohen Adam L.
Lockard Michael S.
Smalley Dennis R.
Thompson Jeffrey A.
Microfabrica Inc.
Smalley Dennis R.
Wong Edna
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