Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...
Reexamination Certificate
2007-01-09
2007-01-09
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating electrolytic or nonelectrolytic coating after it is...
C205S118000, C205S170000, C205S223000
Reexamination Certificate
active
10434103
ABSTRACT:
In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
REFERENCES:
patent: 5011580 (1991-04-01), Pan et al.
patent: 6027630 (2000-02-01), Cohen
patent: 2004/0028849 (2004-02-01), Stark et al.
Arat Vacit
Cohen Adam L.
Lee Christopher J.
Lockard Michael S.
Smalley Dennis R.
Microfabrica Inc.
Smalley Dennis R.
Wong Edna
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