Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With mechanical abrasion or grinding
Reexamination Certificate
2004-06-10
2008-10-21
Wilkins, III, Harry D. (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
With mechanical abrasion or grinding
C205S097000, C204S22400M, C204S212000, C204S225000, C428S131000, C428S141000, C428S174000, C428S209000, C438S692000, C451S041000, C451S285000, C451S287000, C451S288000
Reexamination Certificate
active
07438795
ABSTRACT:
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided having first and second pluralities of unidirectional pores configured to communicate polishing composition between the top and bottom surfaces of the pad. A cyclic flow of composition is established to continuously renew composition to the area of interaction between the pad and the substrate. In another aspect, a polishing apparatus is provided having a polishing composition transfer region between a polishing pad and a platen. Pores disposed through the pad communicate composition from the transfer region to the top surface. To facilitate directing the composition into the pores, the apparatus includes a plurality of protrusions protruding into the transfer region that are aligned with the pores.
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Anjur Sriram P.
Wylie Ian W.
Cabot Microelectronics Corp.
Gross J. Karl
Omholt Thomas E.
Smith Nicholas A.
Weseman Steven D.
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