Electro chemical mechanical polishing method

Details Electro chemical mechanical polishing method Electro chemical mechanical polishing method

2005-02-22

2005-02-22

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S645000, C438S692000, C438S693000

Reexamination Certificate

active

06858531

ABSTRACT:
Embodiments of the invention include a method for electro chemical mechanical polishing of a substrate. The process includes flowing an electro chemical mechanical polishing (ECMP) slurry having a high viscosity with a polishing agent over a portion of the substrate. Electrical current is passed through the slurry and substrate. The electrical current, in conjunction with the abrading action of the slurry as it flows over the surface of the substrate, serves to remove at least a portion of the metal layer from the substrate. The invention also includes various slurry embodiments.

REFERENCES:
patent: 4789648 (1988-12-01), Chow et al.
patent: 5846398 (1998-12-01), Carpio
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5944589 (1999-08-01), Nakajima
patent: 6126532 (2000-10-01), Sevilla et al.
patent: 6368190 (2002-04-01), Easter et al.
patent: 6423640 (2002-07-01), Lee et al.
patent: 6432828 (2002-08-01), Kaufman et al.
patent: 6468913 (2002-10-01), Pasqualoni et al.
patent: 20010013507 (2001-08-01), Hosali et al.
patent: 20020119286 (2002-08-01), Chen et al.
Wang et al., “Stress-free polishing advances copper integration with ultralow-κ dielectrics”, Solid State Technology, Oct. 2001, www.solid-state.com.

Affiliated with

Also associated with

Rating

Electro chemical mechanical polishing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electro chemical mechanical polishing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electro chemical mechanical polishing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3495810