Electrically insulated heat pipe type cooling apparatus for semi

Details Electrically insulated heat pipe type cooling apparatus for semi Electrically insulated heat pipe type cooling apparatus for semi

1993-05-20

1994-02-01

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257715, 257717, 165 804, 16510433, 165185, 361689, 361699, 174 152, H01L 2302, H01L 2504

Patent

active

052834646

ABSTRACT:
An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising a heat absorption section for cooling a semiconductor, a heat dissipation section and an intermediate electrical insulation section. This apparatus is capable of highly improving cooling efficiency for a semiconductor and exhibiting satisfactory electrical insulation.

REFERENCES:
patent: 3792318 (1974-02-01), Fries et al.
patent: 4023616 (1977-05-01), Scherbaum
patent: 4574877 (1986-03-01), Klein
patent: 4675783 (1987-06-01), Murase et al.
patent: 4757370 (1988-07-01), Agonafer et al.
patent: 4899211 (1990-02-01), Dumoulin
patent: 4982274 (1991-01-01), Murase et al.
patent: 5043797 (1991-08-01), Lopes
"Cooling Device for Multilayer Ceramic Modules" by B. T. Clark et al, IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977; pp. 1769-1771.
"Warmtepijpkoeling voor halfgeleidercomponenten" by De Heer M. C. van der Walle, 825 PT/Elektrotechniek Elektronica, 42 (1987) Dec., No. 12, Rijswijk (Z-H), The Netherlands.

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