Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-20
2009-02-17
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S661000, C257SE21159, C257SE21171
Reexamination Certificate
active
07491646
ABSTRACT:
A process for fabricating an electrically conductive feature comprising: (a) liquid depositing a low viscosity composition comprising starting ingredients including an organic anine, a silver compound, and optionally an organic acid, to result in a deposited composition; and (b) heating the deposited composition, resulting in the electrically conductive feature comprising silver.
REFERENCES:
patent: 3702259 (1972-11-01), Nielsen
patent: 6123876 (2000-09-01), Kobayashi et al.
patent: 6197366 (2001-03-01), Takamatsu
patent: 6951666 (2005-10-01), Kodas et al.
patent: 7276385 (2007-10-01), MacKenzie et al.
patent: 2003/0068581 (2003-04-01), Kawamura et al.
patent: 2004/0211979 (2004-10-01), Shioiri et al.
patent: 2005/0127332 (2005-06-01), Nakagawa et al.
patent: 2005/0129843 (2005-06-01), Wu et al.
patent: 2005/0158528 (2005-07-01), Sasaki et al.
patent: 2006/0073667 (2006-04-01), Li et al.
patent: 2006/0110686 (2006-05-01), Park et al.
patent: 2006/0130700 (2006-06-01), Reinartz
patent: 2006/0254387 (2006-11-01), Lee et al.
patent: 1 646 095 (2006-04-01), None
patent: WO 2004/085165 (2004-10-01), None
Ong Beng S.
Wu Yiliang
Everhart Caridad M
Soong Zosan
Xerox Corporation
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