Electrically conductive adhesive

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174257, 174256, 361751, 439 66, H05K 100

Patent

active

054631904

ABSTRACT:
A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).

REFERENCES:
patent: 2413579 (1946-12-01), Pennybacker
patent: 3221189 (1965-11-01), Brandt et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5087494 (1992-02-01), Calhoun et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5286417 (1994-02-01), Mahmoud et al.

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