Electrical trace interconnect assembly

Details Electrical trace interconnect assembly Electrical trace interconnect assembly

1996-04-19

1997-11-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

360103, 360126, H01R 4316

Patent

active

056874790

ABSTRACT:
A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

REFERENCES:
patent: 5027247 (1991-06-01), Nakanishi
patent: 5282103 (1994-01-01), Hatch et al.
patent: 5311384 (1994-05-01), Johnson
patent: 5353181 (1994-10-01), Frater et al.

Affiliated with

Also associated with

Rating

Electrical trace interconnect assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical trace interconnect assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical trace interconnect assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1556854