Electrical through-plating of semiconductor chips

Details Electrical through-plating of semiconductor chips Electrical through-plating of semiconductor chips

2004-12-17

2009-08-11

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S052000, C438S514000, C438S659000, C257S415000, C257S417000, C257S419000, C257SE21481

Reexamination Certificate

active

07572660

ABSTRACT:
A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.

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