Electrical test structure to quantify microloading after plasma

Details Electrical test structure to quantify microloading after plasma Electrical test structure to quantify microloading after plasma

1996-01-18

1997-12-02

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566431, 216 61, H01L 2100

Patent

active

056931786

ABSTRACT:
A microloading quantification apparatus is comprising a supporting substrate, a first bonding pad deposited upon the supporting substrate, a second bonding pad deposited upon the supporting substrate, and an etched conductive pattern deposited upon the supporting substrate and operably connected to the first bonding pad and the second bonding pad. Methods for the formation and application of the microloading quantification apparatus to quantify the variation of the microloading effect as a result of modifications of the set of parameters of integrated circuit processing particularly those of the plasma dry etch are described.

REFERENCES:
patent: 4855253 (1989-08-01), Weber
patent: 5326428 (1994-07-01), Farnworth et al.

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