Electrical programmable metal resistor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S752000, C257S758000, C257SE23011

Reexamination Certificate

active

07122898

ABSTRACT:
The present invention provides an electrical programmable metal resistor and a method of fabricating the same in which electromigration stress is used to create voids in the structure that increase the electrical resistance of the resistor. Specifically, a semiconductor structure is provided that includes an interconnect structure comprising at least one dielectric layer, wherein said at least one dielectric layer comprises at least two conductive regions and an overlying interconnect region embedded therein, said at least two conductive regions are in contact with said overlying interconnect region by at least two contacts and at least said interconnect region is separated from said at least one dielectric layer by a diffusion barrier, wherein voids are present in at least the interconnect region which increase the electrical resistance of the interconnect region.

REFERENCES:
patent: 5485138 (1996-01-01), Morris
patent: 6083785 (2000-07-01), Segawa et al.
patent: 6207560 (2001-03-01), Lee
patent: 6232042 (2001-05-01), Dunn et al.
patent: 2004/0027234 (2004-02-01), Hashimoto et al.
patent: 2004/0134769 (2004-07-01), Wang et al.
patent: 2005/0029662 (2005-02-01), Nakano et al.
patent: 2006/0057835 (2006-03-01), Anderson et al.

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