Electrical package capable of increasing the density of...

Details Electrical package capable of increasing the density of... Electrical package capable of increasing the density of...

2006-07-04

2006-07-04

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23063, C257SE23062, C257SE23011, C257SE23006, C257S668000, C257S774000, C257S773000, C257S737000, C257S738000, C257S734000, C257S691000, C257S698000, C257S693000, C257S692000, C257S678000

Reexamination Certificate

active

07071569

ABSTRACT:
An electrical package and manufacturing method thereof is provided. A high stiffness, high electrical conductivity, low coefficient of thermal expansion and high thermal conductivity support substrate is used as an initial layer for building the package. A multilayer interconnection structure is formed over the support substrate. Thereafter, a plurality of openings is formed over the support substrate. The openings expose a plurality of bonding pads on a bottom surface of the multi-layer interconnection structure. An electronic device is set up over the multi-layer interconnection structure. Contacts are formed inside the opening over the bonding pads.

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