Electrical isolation and leveling of patterned surfaces

Details Electrical isolation and leveling of patterned surfaces Electrical isolation and leveling of patterned surfaces

1986-12-12

1987-09-15

Larson, Lowell A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

H01L 21312

Patent

active

046937803

ABSTRACT:
In the fabrication of micro-electronic circuits, it is often necessary to arrange a number of patterned surfaces be well insulated from each other. At the same time, however, the pattern edges of the layer to be overlaid must present a defined slope angle of between the range of forty to sixty degrees, for example. The invention solves this problem through a two stage coating process in which a polymer is first applied which coats the edges and is then coated with a photoresist having good leveling properties.

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IBM Technical Disclosure Bulletin, vol. 27, No. 2, Jul. 1984, by J. P. Kent, pp. 1147-1150.
IBM Technical Disclosure Bulletin, vol. 13, No. 6, Nov. 1970, by S. A. Abbas et al, p. 1567.

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