Metal fusion bonding – Process – Plural diverse bonding
Patent
1994-10-13
1995-08-29
Rosenbaum, Mark
Metal fusion bonding
Process
Plural diverse bonding
228254, 427125, 427329, 437230, B23K 3100, H01L 2102
Patent
active
054453119
ABSTRACT:
An electrical interconnection substrate (20) is prepared to receive both wire bonded and soldered connections (60,64,66) by forming a dielectric solder mask (30) over the substrate (20), with openings (36) in the mask (30) to expose the contact pads (22) for which soldered connections are desired. The substrate (20) is exposed to a molten solder alloy (44) in a wave soldering process that dissolves the wire bonding material (28) (preferably gold) from the exposed pads (22) and deposits solder bonding pads (52) in its place. Excess solder is then removed from the substrate, and openings (54) are formed through the solder mask (30) to expose the wire bond contact pads (22'). The selective dissolving of gold bonding layers (28) and their replacement by solder pads (52) prevents the establishment of brittle gold-solder intermetallics, and the deposited solder (52) requires no further heat treatment for correct alloy formation.
REFERENCES:
patent: 5002818 (1991-03-01), Licari et al.
patent: 5118385 (1992-06-01), Kumar et al.
patent: 5254493 (1993-10-01), Kumar
Gierhart Thomas J.
Pillai Vincent A.
Trask Philip A.
Denson-Low Wanda K.
Elpel Jeanne M.
Hughes Aircraft Company
Leitereg Elizabeth E.
Rosenbaum Mark
LandOfFree
Electrical interconnection substrate with both wire bond and sol does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical interconnection substrate with both wire bond and sol, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical interconnection substrate with both wire bond and sol will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1814694