Electrical interconnection for attachment to a substrate

Details Electrical interconnection for attachment to a substrate Electrical interconnection for attachment to a substrate

1997-12-16

2000-04-18

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257750, 257758, 257762, 257763, 257764, 257765, H01L 2348, H01L 2352, H01L 2940

Patent

active

060518790

ABSTRACT:
The present invention is An electrical interconnection on a substrate and a method for forming an electrical interconnection on a substrate. The electrical interconnection in the present invention comprises a first metal layer, a first diffusion barrier layer on the first metal layer, a second metal layer on the first diffusion barrier layer, an organometallic layer on the second metal layer, and an electrical interconnect layer on the organometallic layer. The first diffusion barrier layer prevents diffusion of the first metal layer and the second metal layer therethrough. The organometallic layer is preferably formed by contacting the second metal layer with an organic material to form a organometallic layer. The organometallic layer chemically and physically protects the second metal layer, particularly by preventing the oxidation thereof.

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