Electrical interconnect support system with low dielectric const

Details Electrical interconnect support system with low dielectric const Electrical interconnect support system with low dielectric const

1986-11-24

1987-07-21

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156644, 1566591, 156665, 156667, H01L 2100

Patent

active

046816550

ABSTRACT:
A method of fabricating an anodic aluminum support system having an air bridge for metallic conductors. The method includes providing two or more metal layers separated by a coating of aluminum creating a multiple layer electrical interconnect system. The method includes the step of anodizing the aluminum and applying a photoresist mask to spaced portions of the top of the system. Thereafter, an etching solution is applied to the top of the system for removing the anodized aluminum, except for the portions covered by the mask, thereby providing a multilayer conductor system supported by pillars of anodic aluminum surrounded by low dielectric air.

REFERENCES:
patent: 3789470 (1974-02-01), Owaki et al.
patent: 4023999 (1977-05-01), Lindberg et al.
patent: 4155155 (1979-05-01), Bourdon et al.
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4541893 (1985-09-01), Knight

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