Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2011-01-11
2011-01-11
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C438S215000, C438S281000, C438S333000, C438S601000, C257SE23149
Reexamination Certificate
active
07867832
ABSTRACT:
A semiconductor fuse and methods of making the same. The fuse includes a fuse element and a compressive stress liner that reduces the electro-migration resistance of the fuse element. The method includes forming a substrate, forming a trench feature in the substrate, depositing fuse material in the trench feature, depositing compressive stress liner material over the fuse material, and patterning the compressive stress liner material.
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Notice of Allowance in U.S. Appl. No. 11/550,943, Oct. 2008.
Yang Chih-Chao
Yang Haining S.
Fourson George
International Business Machines - Corporation
MacKinnon Ian
Roberts Mlotkowski Safran & Cole P.C.
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