Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-09-19
1992-05-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156645, 156656, 156664, C23F 102, B44C 122
Patent
active
051164582
ABSTRACT:
An electrical edge contact member for use in an integrated circuit chip burn-in connector is formed as a laminate of at least one layer of a first material having good spring properties and at least one layer of a second material which does not form a solid solution with the surface material of the integrated circuit chip lead. Along the edge of the contact member where it contacts the chip lead the layers of the first material are recessed with respect to the layers of the second material, so that only the second material contacts the integrated circuit chip lead.
REFERENCES:
patent: 3956814 (1976-05-01), Peet
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4404059 (1983-09-01), Livshits et al.
AMP Incorporated
Osborne Allan B.
Powell William A.
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